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 Silicon PIN diode
FEATURES * High voltage, current controlled * RF resistor for RF switches * Low diode capacitance * Low diode forward resistance (low loss) * Very low series inductance. 1 APPLICATIONS CATHODE * RF attenuators and switches * Bandswitch for TV tuners * Series diode for mobile communication transmit/receive switch. DESCRIPTION Planar PIN diode in a SOD523 ultra small SMD plastic package.
BAP65 - 02
1
2 ANODE
2
SOD523 SC-79
LIMITING VALUES In accordance with the Absolute Maximum Rating System (IEC60134). SYMBOL I VR IF P tot T stg Tj PARAMETER continuous reverse voltage continuous forward current total power dissipation storage temperature junction temperature T s < 90C CONDITIONS MIN. - - - -65 -65 MAX. 30 100 715 +150 +150 UNIT V mA mW C C
ELECTRICAL CHARACTERISTICS T j = 25C unless otherwise specified. SYMBOL VF IR Cd PARAMETER forward voltage reverse current diode capacitance CONDITIONS I F =50 mA V R =20 V V R = 0; f = 1 MHz V R = 1 V; f = 1 MHz V R = 3 V; f = 1 MHz r D diode forward resistance V R = 20 V; f = 1 MHz I F = 1 mA; f = 100 MHz; I F = 5 mA; f = 100 MHz; note 1 I F = 10 mA; f = 100 MHz; note 1 |s 21| 2 isolation I F = 100 mA; f = 100 MHz; V R = 0; f = 900 MHz V R = 0; f = 1800 MHz V R = 0; f = 2450 MHz |s 21| 2 insertion loss I F = 1 mA; f = 900 MHz I F = 1 mA; f = 1800 MHz I F = 1 mA; f = 2450 MHz I F = 5 mA; f = 900 MHz I F = 5 mA; f = 1800 MHz I F = 5 mA; f = 2450 MHz |s 21| 2 insertion loss I F = 10 mA; f = 900 MHz I F = 10 mA; f = 1800 MHz I F = 10 mA; f = 2450 MHz I F = 100 mA; f = 900 MHz I F = 100 mA; f = 1800 MHz I F = 100 mA; f = 2450 MHz TYP. 0.9 - 0.65 0.55 0.5 0.375 1 0.65 0.56 0.35 10 5.8 4.4 0.11 0.13 0.16 0.08 0.11 0.13 0.07 0.1 0.13 0.07 0.1 0.128 MAX. 1.1 20 - 0.9 0.8 - - 0.95 0.9 - - - - - - - - - - - - - - - - UNIT V nA pF pF pF pF dB dB dB dB dB dB dB dB dB dB dB dB dB dB dB
|s 21|
2
insertion loss
|s 21|
2
insertion loss
S27-1/2
BAP65-02
ELECTRICAL CHARACTERISTICS T j = 25C unless otherwise specified. (Continue) SYMBOL L PARAMETER charge carrier life time CONDITIONS when switched from I F =10 mA to I R = 6 mA; R L = 100 ; measured at I R =3 mA I F =10 mA ; f =100MHz TYP. 0.17 MAX. - UNIT s
L
S
series inductance
0.6
-
nH
Note 1. Guaranteed on AQL basis: inspection level S4, AQL 1.0. THERMAL CHARACTERISTICS SYMBOL Rth j-s PARAMETER thermal resistance from junction to soldering-point VALUE 85 UNIT K/W
10 f = 100 MHz; T j =25C
1000
800
1
C d (pF)
r D( )
600
400
200
10 -1
f = 1 MHz; T j =25C 10 -1 1 10 10 2 0 0 4 8 12 16 20
I F (mA )
VR(V)
Fig.1 Forward resistance as a function of forward current; typical values.
Fig.2 Diode capacitance as a function of reverse voltage; typical values.
0 0
-0.1
- 10
|s 21| 2(dB)
-0.2 (1) (2) (3) (4) (5) I F =0.5 mA. I F =1 mA. I F = 5 mA. I F = 10 mA. I F = 100mA.
|s 21| 2(dB)
- 20
-0.3
- 30 -0.4
Diode inserted in series with a 50 stripline circuit and biased via the analyzer Tee network. Tamb =25C. Diode zero biased and inserted in series with a 50 stripline circuit. Tamb =25C.
-0.5 0 1 2 3
- 40 0 1 2 3
f (GHz )
f (GHz )
Fig.3 Insertion loss ( |s 21| 2 )of the diode in on-state as a function of frequency; typical values.
Fig.4 Isolation ( |s 21| 2 ) of the diode in off-state as a function of frequency; typical values.
S27-2/2


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